Flexible High Quality Color AOI
- 4 or 6 sided inspection of MLCC, MLI, R-chips or LED's
- High speed: up to 6000 pcs/min for 0201 4 sides
- Flexibility: one bowl feeder for 01005 to 0402 or 0603 to 2220
- Fast change over: No lens changes
- Software: top notch algorithm, easy to operate and customizable
- Color CCD cameras: precise defect recognition formerly undetectable
- Low/no consumable cost
Haiku Tech introduces a vision inspection machine with an outstanding performance/speed ration. Superior software in combination with high quality components meets the demand of passive components manufacturers for high quality visual inspection.
The machine comes with a wear off free vibration feeder
that transports chips to a rotating glass plate where
images of four or six sides are taken by CCD color
cameras. The inspection information is processed and
transmitted to highly accurate air pressure releasing
valves. They sort the chips according to the determined
defects into 1 OK, 1 retest and 4 NG bins. The machine
runs completely automatic allowing one operator to
handle multiple machines by refilling the hoppers with
chips.
State of the art software achieves sophisticated standards
of reliability and repeatability at a high inspection speed.
The machine runs with an efficient algorithm to achieve a
low inspection failure rate. An encoder equipped with a
high resolution digital signal processing guarantees the
correct chip location for inspection. This feature
Advantages
- Process Flexibility: Inspects chips even to the smallest size 01005
- Production statistics: Instantly displays real time failure statistics
| Inspection Quality: |
Inspects defects according to individual parameter settings |
| High positioning accuracy: |
Encoder accurately positions the chips for a correct inspection. |
| Hardware: |
Uses the latest high resolution cameras and components |
| Consumables: |
Only the glass plate due to the use of a vibration feeder |
| Image storage: |
Stores the latest 200 examined images |
| Image display: |
Immediately displays the picture of each defected chip |
Dimensional Measurements
- Length
- Width
- Thickness
- Termination Bandwidth
- Term to Term
- Term Gap
- Term Incomplete
- Body Width
- Body Length
- Termination Pad Sizes (Min-Max)
Ceramic Defects
- Chipping
- Crack
- Internal Exposure Electrode
- Blister
- Burst
- Pin Hole
- Scratches
- Surface Contamination
- Discoloration
Termination Defects
- Broken
- Miss-Plating
- Pin Hole
- Scratches
- Smears
- Existence
- Surface Contamination
- Body Smear
- Body Stain
- Body Chip off
- Body Scratch
- Peel Termination