Top CCD, recognition of ODR products
- Breaks 12 inch wafer attached to 12 inchflat ring
- Capable of working on wafers with metal balls on surface
- Fully automatic wafer loading / unloading, tape attachment, breaking and tape removal
- Top CCD provides vertical image from above; dual CCD design
Technical Specification
| Dimensions |
2460 mm × 1870 mm × 2250 mm (ＷｘＤｘＨ) including signal indicators |
| Weight |
1300 kg |
| AC power |
3Φ /220 60HZ Volt.(V) |
| Air supply |
Air Pressure 5 Kgf/cm2 |
|
Air Tube Diameter Ø 12 mm |
| Vacuum source |
Vac. Tube Diameter Ø 8 mm |
| Wafer size |
12 inch |
| Chip size |
2 ˜ 10mm |
| Laser cut depth |
None |
| Flat ring size |
12 inch |
Features
| High resolution |
High-resolution digital camera (effective improvement of identification); multiple CCDs for various sizes. |
| Graphic identification |
Image identification is performed graphically; one image for each of sides A and B for image identification. |
| High precision |
Step servo motor for key mechanism, high-precision linear motor. |
| Leveling adjustment |
Starting at auto breaking mode and adjusting the level have been double checked to make sure the level is correct. |
| Automatic alignment |
Y-axis aligns automatically (set each cut or any cut to align once). |
| Calibration alignment |
θ-axis calibration and Y-axis alignment (set each cut or any cut to align once). |
| Multiple modes |
Multiple breaking modes are provided for a wide range of products, such as edge breaking, skipped breaking and mixed breaking. |
| Manual |
Manual breaking and secondary breaking are provided. |