Suitable for silicon and Sapphire wafers
- It adopts the Robot arm to raise the performance.
- The product can also be switched to the manual mode. It supports to process a small amount of rings or broken wafer quickly.
- The product can be paused in the automatic mode to fill rings, wafers, and films.
- According to the requirements of process, the product can process a stack of rings.
Technical Specification
| Dimensions |
2320 mm × 2210 mm × 2620 mm (LｘWｘＨ) |
| Weight |
2100 kg |
| AC power |
Working voltage 240V 50/60Hz 1 Φ Volt.(V) |
|
Power switch (NFB) 60 A |
| Air supply |
Air Pressure 5 - 8 Kgf/cm2 |
|
Air Tube Diameter Ø 12 mm |
| Wafer size |
4, 6 or 8 inch |
| Chip size |
None |
| Laser cut depth |
None |
| Flat ring size |
8 inch or 5.5 inch |
| Tape size |
for 8-inch frame can be 300 mm x 100 M |
|
for 5-inch frame can be 230 mm x 100 M |
Features
| Film detections |
Support the detections for film mounting and lack. |
| Automatic |
Fully automatic rapid production. |
| Alignment |
Alignment sensor for wafer alignment mechanism. |
| Barcode reader |
Wafer ID reader. And Ring barcode reader. |
| Quick replacement |
Quick replacement of membrane and waste material reels. |
| Minimize reduce |
Reduce the operation cost by minimizing the tape consumption to about 275 mm. |
| Tension-adjustable |
Tension-adjustable tape supports the optimum dicing conditions. |
| Heating |
Wafer suction platform can be heated to 50 °C. |
| Airbag |
The airbag is flexible and the film will be mounted on the wafer closely. |