Thin Carrier Plate Dipper

LGTM-6100 Series

Thin Carrier Plate Dipper for lowest cost production of MLCC, etc.

Thin Carrier Plate Dipper LGTM-6100 Series
  • Low cost per dipped component
  • Dipping accuracy 10 microns
  • Suited for high volume production
  • For 0201 up to 2520 chip sizes
  • Capacity up to 800.000 pieces per hour
  • Superior dipping results
  • Round or diamond shaped holes
  • Fast heating and cooling during drying
  • Allows two sided dipping
  • Very low tooling cost

Thin Carrier Plates

Thin Carrier Plate

The unique Thin Carrier Plate assures a high chip holding forcewith high centering accuracy. The thin carrier plate requires very low energy consumption during the drying process because of the low thickness and material choice. With an unparalleled number of chips per plate the dipping process is extremely efficient.

Designed for dipping of end terminals on surface mount components. The special design assures a flexible dippingprocess with a high production capacity and high quality terminations. The programmable dipping parameters allow optimization of the paste deposition and reduction of defects. Optional tooling for loading and unloading of components is available for manual and fully automated production.

Technical Specification

Holes: 496 - 18.128 / plate
2 side dip: > 0603
Chip sizes: 0201 - 2520 (Other chip sizes on request)
Hole precision: ± 10 microns
Paste thickness: ± 10 microns
Dipping head positioning: ± 2 microns
Ink tray flatness: ± 5 micron
HMI: Color touch screen (Fully programmable dipping process)
Vacuum: 650mm Hg
Air pressure: 0.5 MPa
Size: 1200 x 1000 x 1950 mm
Weight: 700 kg (manual loading)

How to order

| | | |
| | | D in case of double pressure vessel size
| | Max. pressure 6 for 6000PSI, 10 for 10000PSI
| Max. bar size in inch: 4 or 6 or 10 or 12
Isostatic Laminator