Array Metallization Dipper

LGTM-3900 Series

Array dipping of MLCC, MLCI, MLV, LTCC etc.

Array Metallization Dipper LGTM-3900 Series
  • Very accurate termination position
  • Dipping resolution 1 micron
  • Blotting function
  • Anti airbubble function
  • Capacity up to 50.000 pieces per hour
  • Superior dipping results
  • Diamond shaped holes with ± 15micron position accurac
  • Fast heating and cooling during drying
  • Lowest energy consumption
  • Very low tooling cost

The unique Thin Array Carrier Plate with diamond shaped openings assures a high chip holding force with high centering accuracy. The thin carrier plate requires very low energy consumption during the drying process because of the low thickness and material choice. The drying process is therefore predominantly defined by the paste parameters.

Designed for dipping of array terminations on ceramic components The dedicated design assures a flexible dipping process with a high production capacity and high quality terminations. The programmable dipping parameters allow optimization of the paste deposition and reduction of defect terminations by unique anti air bubble removal functions.

Technical Specification

Holes: 1030 holes per plate for 0204-0508
704 holes per plate for 0610-0612
Other chip sizes on request
TACP size: 152 x 152 mm
Hole precision: ± 15 microns
Paste plate: 242 x 202 x 15.6 mm
Groove size made on request
Plate parallelism 10 microns
Paste Box: 154 x 124 x 20 mm
HMI: Color touch screen (Fully programmable dipping process)
Vacuum: 650mm Hg
Air pressure: 0.5 MPa
Size: 1200 x 1000 x 1950 mm
Weight: 600 kg

How to order

| | | |
| | | D in case of double pressure vessel size
| | Max. pressure 6 for 6000PSI, 10 for 10000PSI
| Max. bar size in inch: 4 or 6 or 10 or 12
Isostatic Laminator