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[ NOVEMBER 2007 ]

Haiku Tech introduces the first Keko Equipment fully automatic SOLAR CELL SCREEN PRINTING LINE.

The line features the highest printing speed available in the industry with ultra low wafer breakage due to the advanced transporting technology. We invite you to come to our facilities for a demonstration! Or you can see the equipment at the Productronica show in Munich, Germany.

Date:
    November 13-16, 2007
Booth #:
    A4.255
Link
     Booth A4.25

 

[ NOVEMBER 2007 ]

Haikutech develops competitive LED WAFER breaker

The vision controlled BW200a wafer breaker is suitable for the seamless production of GaAs chips for high lumen LED-production. The technology used allows for better speeds at lower defect rates. The first 6 systems have now been shipped to our lead customer. For more info contact Roderik Höppener at rhoppener@haikutech.com.

 

[ SEPTEMBER 2007 ]

Meet us at the Tenth Grove Fuel Cell Symposium London, UK If you want to set up a meeting please contact Mr. Hendrikus Oostra at +31 43 4578054 and you will be connected to his mobile phone at the show.

Date:
    September 25-27, 2007

 

[ AUGUST 2007 ]

Haiku Tech and Long Automatic machinery of Taiwan reach agreement on representation of metallization product line in USA and Europe.

Haikutech is proud to announce the finalization of the development of the innovative 0201 dipping by the thin carrier plates developed by Long Automatic. Höppener of Haikutech mentions: "the addition of this new technology gives our customer the long time awaited cost reduction and yield improvement in the 0201 and array metallization."

 

[ JUNE 2007 ]

Meet us at the 10th International Conference and Exhibition of the European Ceramic Society in Berlin.
If you want to set up a meeting please contact Mr. Hendrikus Oostra at +31 43 4578054 and you will be connected to his mobile phone at the show.

Date:
    June 18-21, 2007

 

[ APRIL 2007 ]

Haiku Tech will exhibit at the Hannover Fair 2007: Hydrogen and Fuel Cell Exhibit in Hannover on April 16-20, 2007. We will present our new line of tape casting equipment, materials for SOFC fuel cells and automated high throughput printers for fuel cell/solar cell screen printing. Please contact us if you would like to receive free entry passes.

Date:
    April 16-20, 2007
Booth #:
    G10/2
Show info:
    www.fair-pr.com

 

[ MARCH 2007 ]

Alfred University selects Haiku Tech for their Ceramic Nanotechnology Facility.

The Alfred University Center for Advanced Ceramic Technology (CACT) has selected Haiku Tech and Keko Equipment to supply Multilayer Ceramic Prototyping Equipment for their new Ceramic Nanotechnology Facility.

The funds are a NYSTAR grant to the Alfred University Center for Advanced Ceramic Technology (CACT) and Clarkson University's Center for Advanced Materials Processing (CAMP) to "develop pilot plant facilities and expertise in the synthesis of nano-sized particles and subsequent processing and consolidation into nano-structured ceramic components with enhanced properties."

What that means is that Clarkson University's Center for Advanced Materials Processing will develop molecular-sized building blocks for new materials. Alfred researchers will then process and test the new materials for their suitability for use in the manufacture of electronic components.

Nanotechnology is engineering on a molecular scale, creating new materials by designing them atom-by-atom, molecule-by-molecule, to give them specific properties, such as strength or toughness; the ability to conduct heat or electrical current; or compatibility with the human body.

Press Release:
    www.alfred.edu

 

[ MARCH 2007 ]

Haiku Tech Inc. will exhibit at the Capacitor and Resistor Symposium (CARTS) 2007 in Albuquerque, New Mexico, USA. Please join us in our booth to exchange ideas regarding the latest solutions we offer to manufacture Multilayer Electronic Passive Components.

Date:
    March 27-28, 2007
Booth #:
    306
Show info:
    CARTSUSA

 

[ DECEMBER 2006 ]

Haiku Tech introduces a new metallization technology with a cost reduction up to 50 %: the thin carrier plate. A thin steel carrier uses silicon inserts from which the two ends of chips larger than 0603 protrude. Therefore no turning of chips is needed. The thin plate has better holding for 0402 and 0201 chips, resulting in improved dipping accuracy and less damage. Due the low weight and an improved dryer, a fast drying cycle is possible (1-2 min). The innovative technology is available for demonstration in an automatic dipping line.

 

[ NOVEMBER 2006 ]

Haiku Tech Inc. will exhibit at the Fuel Cell Seminar in Hawaii on November 13-17, 2006. We will present our new line of tape casting equipment and automated high throughput printers for fuel cell/solar cell screen printing.

Exhibition Hours:

Mon, Nov. 13 05:00 pm–07:00 pm
Tue, Nov. 14 11:00 am–05:00 pm
Wed, Nov. 15 11:00 am–05:00 pm
Thu, Nov. 16 11:00 am–02:00 pm

Booth #:
    228
Show info:
    www.fuelcellseminar.com

 

[ OCTOBER 2006 ]

Haiku Tech will exhibit at the 39th Symposium on Microelectronics (IMAPS 2006) in San Diego, CA on October 8-12, 2006. Please join us at our booth to exchange ideas regarding the latest manufacturing solutions for Microelectronic Components.

Exhibition Hours:

Tue, Oct. 10 10:00 am–05:00 pm
Wed, Oct. 11 09:00 am–05:00 pm
Thu, Oct. 12 09:00 am–12:00 pm

Booth #:
    325
Show info:
    www.imaps.org

 

[ JUNE 2006 ]

Haiku Tech Inc. will exhibit at the ICC conference in Toronto on June 26-27, 2006. In the booth an optical dilatometer will be on display.

Exhibition Hours:
    3:30 - 6:00 pm
Booth #:
    102
Show info:
    http://www.ceramics.org/icc/

 

[ MAY 2006 ]

New product release. Haiku Tech Inc. introduces a new low cost electroplating unit for small and medium volume automated production of MLCC's and similar products. The Haiku EP-6 and 8 are tailored for Ni/Sn plating in smaller plants for case sizes down to 0402.

 

[ MARCH 2006 ]

GET Systems to close down their facility. In view of slow demand GET Systems is down sizing their operation and restructuring customer support. The supply of spare parts should recommence in June/July 2006.

 

[ JANUARY 2006 ]

New Product release Haiku Tech introduces the Keko Equipment dual color roll to roll printer for the manufacture of MLCC high caps with ceramic tape thickness below 2 microns.

 

[ OCTOBER 2005 ]

Polymer Innovations Inc facility in Vista Polymer Innovations Inc, the technology leading supplier of water based tape casting binders and metal pastes, moved to a larger 3300 sq ft facility in Vista to accommodate the increased demand for binder and the company's expansion.

 

[ MAY 2005 ]

Haiku Tech Europe delivers full LTCC line to the Centre for Materials for Electronics Technology in Pune, India. Centre for Materials for Electronics Technology is a Scientific Society Registered under the Indian Ministry of Information Technology, with the main objective to establish technology strength in electronics materials for the present and future industrial requirement in all of India.

 

[ APRIL 2005 ]

Haiku Tech Europe signs contract with major fuel cell producer for delivery of tape caster and an automated screen printing line.

 

[ MARCH 2005 ]

Florida International University and Haiku Tech Inc. jointly perform LTCC paste compatibility study using novel hot stage microscopy. The innovative high temperature vision materials analysis tool was supplied by Expert System Solutions. The study will investigate the shrinkage behavior during sintering, wetting and compatibility of ceramic green tapes produced by tape casting and metallization pastes.

[ FEBRUARY 2005 ]

Haiku Tech Inc. reaches agreement with PDC Corporation of Taiwan for the exclusive distribution of their ceramic dielectric powders and titanates in the Americas and Europe.