Component Inspection & Sorting System

Haikuracy A-2800

Flexible High Quality Color AOI

  • 4 or 6 sided inspection of MLCC, MLI, R-chips or LED's
  • High speed: up to 6000 pcs/min for 0201 4 sides
  • Flexibility: one bowl feeder for 01005 to 0402 or 0603 to 2220
  • Fast change over: No lens changes
  • Software: top notch algorithm, easy to operate and customizable
  • Color CCD cameras: precise defect recognition formerly undetectable
  • Low/no consumable cost
Vision inspection

Haiku Tech introduces a vision inspection machine with an outstanding performance/speed ration. Superior software in combin ation with high quality components meets the demand of passive components manufacturers for high quality visual inspection.

The machine comes with a wear off free vibration feeder that transports chips to a rotating glass plate where images of four or six sides are taken by CCD color cameras. The inspection information is processed and transmitted to highly accurate air pressure releasing valves. They sort the chips according to the determined defects into 1 OK, 1 retest and 4 NG bins. The machine runs completely automatic allowing one operator to handle multiple machines by refilling the hoppers with chips.

State of the art software achieves sophisticated standards of reliability and repeatability at a high inspection speed. The machine runs with an efficient algorithm to achieve a low inspection failure rate. An encoder equipped with a high resolution digital signal processing guarantees the correct chip location for inspection. This feature

Advantages

  • Process Flexibility: Inspects chips even to the smallest size 01005
  • Production statistics: Instantly displays real time failure statistics
Inspection Quality: Inspects defects according to individual parameter settings
High positioning accuracy: Encoder accurately positions the chips for a correct inspection.
Hardware: Uses the latest high resolution cameras and components
Consumables: Only the glass plate due to the use of a vibration feeder
Image storage: Stores the latest 200 examined images
Image display: Immediately displays the picture of each defected chip

Dimensional Measurements

  • Length
  • Width
  • Thickness
  • Termination Bandwidth
  • Term to Term
  • Term Gap
  • Term Incomplete
  • Body Width
  • Body Length
  • Termination Pad Sizes (Min-Max)

Ceramic Defects

  • Chipping
  • Crack
  • Internal Exposure Electrode
  • Blister
  • Burst
  • Pin Hole
  • Scratches
  • Surface Contamination
  • Discoloration

Termination Defects

  • Broken
  • Miss-Plating
  • Pin Hole
  • Scratches
  • Smears
  • Existence
  • Surface Contamination
  • Body Smear
  • Body Stain
  • Body Chip off
  • Body Scratch
  • Peel Termination